SDPPI News: New Policy on Paperwork Process through Module Certificate and New Application Documents Requirement

Dear Valued Customers and Friends,

Hope this announcement finds you well.

We’re writing here due to the new official announcement issued by SDPPI just some time ago. There are 2 official announcements issued, concerning about paperwork certification through existing SDPPI module certificate and new document requirement.

First of, it is about paperwork certification through existing SDPPI module certificate (Visit this link for the official announcement). As we know, on September 14th 2017, SDPPI issued a policy stating that they allow paperwork application for end product that has SDPPI-certified RF module inside. But, apparently, there is possibility for this policy to be abused as explained below.

Currently, SDPPI found some applications, especially for handphone, handheld computer, and tablet products with 4G feature in it, which are proposed by using paperwork scheme by referring to existing SDPPI module certificate. This paperwork scheme is apparently chosen to avoid TKDN (Local Component Level) requirements (as we know, handphone, handheld computer, and tablet product with 4G feature in it is mandatory to fulfill TKDN). As a result of this act, there is possibility for these handphone, handheld computer, and tablet products that have 4G features are able to pass SDPPI certification process without fulfilling TKDN requirements.

To anticipate this thing to happen, SDPPI through its Standardization Director’s official announcement with the number 1116/SP.04.03/P/07/2018, issued another policy that starting from the issuance of this announcement, documents evaluation through existing modular certificate is not applicable for handphone, handheld computer, and tablet anymore. Therefore, for these kinds of products, applicable certification ways are by doing regular application with testing or through paperwork by using SDoC (Declaration of Conformity) scheme only.

Second announcement is about new documents requirement that is mandatory to be enclosed along with other application documents (Visit this link for the official announcement). This document is “Payment Agreement Letter”, which will be provided by our project handlers after you send us inquiries.

The background of this new policy is related to the application of new new regulation PP No. 24 Tahun 2018 about Electronically Integrated Business Licensing Services, and SDPPI plan to apply new regulation about Communication Equipment Certification Operational Provisions which will revise the current Communication and Information Ministry number 18 2014 about Telecommunication Equipment Certification.

With the application of these two new regulations, SDPPI asks for agreement letter to state that applicant is agree to pay additional fee if there is deviation occurred between nominal mentioned on the Payment Notification Letter (SP2) issued under Communication and Information Ministry number 18 2014, with the Payment Notification Letter issued under the new regulations mentioned above.

Another background of this “Payment Agreement Letter” is the fact that currently SDPPI issued additional Payment Notification Letter (SP2) for several applicants who did paperwork process in 2015. Back on that time, there was a mistake in calculating certification cost, causing the nominal mentioned on the Payment Notification Letter was different to the actual nominal that should be paid based on the regulation. Regarding to this matter, additional SP2 was issued for some applicants to charge the insufficient payment. But in real case, many applicants denied to pay this insufficient payment since they have paid the full payment that was charged back on 2015.

That’s all we need to announce. Hopefully it could bring better understanding toward current certification process in SDPPI. Should you have something to confirm, we’re inviting you to contact our contact window.

Best Regards!